Recent advances in the mathematical model developments of Convection processes in nano liquids occupying a tilted slot

Authors

  • Amrutha H.P., Dr. A.S. Hari Prasad, Kavya H.S., Dr. Prashanth B Author

Keywords:

Convection, Fluid, Tilt, Model, Simulation.

Abstract

This research paper investigates the intricate interplay of convection within nano liquids occupying a tilted slot geometry, employing a rigorous mathematical modeling approach. The study explores the impact of the tilted slot configuration on heat transfer dynamics and assesses the influence of nanoparticle suspensions on thermal behavior. The mathematical models successfully capture the complex interactions, revealing significant alterations in flow patterns and temperature distributions induced by the tilted geometry. Furthermore, the incorporation of nanoparticles is shown to enhance heat transfer efficiency, emphasizing the potential applications in advanced thermal management systems. The mathematical framework, validated through comparison with experimental data, establishes a reliable foundation for understanding convective heat transfer in nanofluids within tilted slots. Insights into temperature gradients and nanoparticle dispersion are crucial for optimizing heat dissipation and preventing localized hotspots. The study not only contributes to the fundamental understanding of heat transfer processes but also holds practical implications for engineering applications, particularly in electronic device cooling.  The conclusions drawn from the mathematical modeling underscore the importance of considering geometric factors and nanoparticle suspensions in the design of efficient cooling systems. Future research directions are identified, suggesting avenues for exploring varying nanoparticle concentrations and different tilted slot angles to broaden the applicability of the models. Overall, this research enriches the understanding of convection in nanofluids within complex geometries, paving the way for advancements in nanofluid-based technologies and their integration into diverse engineering applications.

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Published

2023-12-08

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Section

Articles